doc. no : qw0905- rev. : date : data sheet LG5230-PF ligitek electronics co.,ltd. property of ligitek only rectangle type led lamps 28 - mar. - 2006 LG5230-PF a lead-free parts pb
60 -60 25% 100%50% 75%25% 0 100% 50%75% -30 0 30 LG5230-PF ligitek electronics co.,ltd. property of ligitek only package dimensions note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation + - 25.0min 2.54typ 1.0min 1.5max part no. 1/5 page 7.0 0.5 typ 2.0 5.0
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 100 -40 ~ +100 -40 ~ +85 ir10 ratings g 120 30 mw a ma ma unit ligitek electronics co.,ltd. property of ligitek only page2/5 110 viewing angle 2 1/2 (deg) min. 3.0 20 min. 1.7 forward voltage @ ma(v) max. 2.6 peak wave length pnm 565 spectral halfwidth nm 30 typ. luminous intensity @10ma(mcd) 6.0 emitted green part no LG5230-PF material gap lens color green diffused part no. LG5230-PF
ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current 1000 100 10 forward current(ma) 1.0 5.0 4.0 3.0 2.0 forward voltage(v) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a g chip 1000 10 1.0 1.0 0.1 f o r w a r d c u r r e n t ( m a ) 100 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage 3.0 2.0 1.0 1.5 2.5 fig.4 relative intensity vs. temperature 100 40 20 06080 0.0 100-40 020406080 ambient temperature( ) -20 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.5 1.2 1.1 0.9 1.0 0.8 -40-20 1.0 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) wavelength (nm) 0.5 0.0 r e l a t i v e i n t e n s i t y @ 2 0 m a page3/5 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 650 600 550 500 part no. LG5230-PF
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 50 0 0 preheat 25 120 2 /sec max 150 100 time(sec) 260 c3sec max 5 /sec max 260 temp( c) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 4/5 60 seconds max part no. LG5230-PF
the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. solderability test 1.t.sol=230 5 2.dwell time=5 1sec thermal shock test high temperature high humidity test solder resistance test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test high temperature storage test low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: test condition test item description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard 5/5 page part no. LG5230-PF
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